Interim Action HeNe Reliability Test Chip e- Machine Qual HPS Wirebond Encapsulation Devices Six Sigma Oven Bake Headers Die Attach Housing 8D Criteria Metal Can PCB Plasma Cleaning SGA Vacuum Machine Tagging MRR Training Epoxy Root Cause Preventive Action Quality Hero Tape and Reel PRC Failure Analysis Cleanroom Electrostatic Discharge Improve Dock Audit PDA Lean Continuous Improvement Trim & Form Leadframes MBB Component Insert Corrective Action Good Unit Visual Inspection CRB CoC Modules Risk Analysis Mold Line Audit MPC Audit Control Plan MQS PIF Quality Month Wedge Pot Temperature & Humidity Document ARN Electrical Test Preventive Maintenance Temperature Cyle FMEA Why- why Analysis Sustainability Project Management ISO Standard Ceramics Fish Bone Diagram Products MSL Casting OSCP Reflow Packaging 3rd Part Audit RMA Specification Is- Is Not Analysis Soldering MRB Poka Yoke Interim Action HeNe Reliability Test Chip e- Machine Qual HPS Wirebond Encapsulation Devices Six Sigma Oven Bake Headers Die Attach Housing 8D Criteria Metal Can PCB Plasma Cleaning SGA Vacuum Machine Tagging MRR Training Epoxy Root Cause Preventive Action Quality Hero Tape and Reel PRC Failure Analysis Cleanroom Electrostatic Discharge Improve Dock Audit PDA Lean Continuous Improvement Trim & Form Leadframes MBB Component Insert Corrective Action Good Unit Visual Inspection CRB CoC Modules Risk Analysis Mold Line Audit MPC Audit Control Plan MQS PIF Quality Month Wedge Pot Temperature & Humidity Document ARN Electrical Test Preventive Maintenance Temperature Cyle FMEA Why- why Analysis Sustainability Project Management ISO Standard Ceramics Fish Bone Diagram Products MSL Casting OSCP Reflow Packaging 3rd Part Audit RMA Specification Is- Is Not Analysis Soldering MRB Poka Yoke
(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.
O-Interim Action
G-HeNe
I-Reliability Test
G-Chip
G-e-Machine Qual
B-HPS
B-Wirebond
N-Encapsulation
N-Devices
G-Six Sigma
G-Oven Bake
O-Headers
I-Die Attach
O-Housing
I-8D
I-Criteria
O-Metal Can
N-PCB
O-Plasma Cleaning
B-SGA
I-Vacuum
N-Machine Tagging
O-MRR
B-Training
O-Epoxy
I-Root Cause
G-Preventive Action
N-Quality Hero
B-Tape and Reel
B-PRC
B-Failure Analysis
B-Cleanroom
O-Electrostatic Discharge
I-Improve
I-Dock Audit
N-PDA
O-Lean
B-Continuous Improvement
G-Trim & Form
N-Leadframes
N-MBB
N-Component Insert
N-Corrective Action
G-Good Unit
O-Visual Inspection
N-CRB
B-CoC
I-Modules
N-Risk Analysis
I-Mold
G-Line Audit
N-MPC Audit
N-Control Plan
B-MQS
O-PIF
G-Quality Month
G-Wedge Pot
B-Temperature & Humidity
I-Document
N-ARN
B-Electrical Test
G-Preventive Maintenance
O-Temperature Cyle
O-FMEA
N-Why-why Analysis
B-Sustainability
I-Project Management
I-ISO Standard
G-Ceramics
I-Fish Bone Diagram
I-Products
I-MSL
B-Casting
B-OSCP
N-Reflow
B-Packaging
O-3rd Part Audit
G-RMA
G-Specification
O-Is- Is Not Analysis
I-Soldering
G-MRB
O-Poka Yoke