Scintillatorused inindirect toconvertxrays tovisbile lightConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofWindowLevelProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseHighSpatialResolutionWhen youhave a highfill factor,you get thisPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposurePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionPostprocessingwhat we cando to theimage after itis displayedImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsADCconverts theanalogelectronicsignal into adigital signalCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellDACConverts digitalsingal back toanalog soimage can beviewed on themontiorThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalAmporhousSiliconWhat thephotodiodeis made of inindirectconversionSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imagePixelPitchthe physicaldistancebetweenpixelsEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorAnnotationAddingtext ormarkers tothe imageImageInversionchanges blackareas of theimage to whiteand whiteareas to blackMagnificationAllowsincreasedvisualizationof an area ofconcernQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedScintillatorused inindirect toconvertxrays tovisbile lightConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofWindowLevelProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseHighSpatialResolutionWhen youhave a highfill factor,you get thisPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposurePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionPostprocessingwhat we cando to theimage after itis displayedImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsADCconverts theanalogelectronicsignal into adigital signalCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellDACConverts digitalsingal back toanalog soimage can beviewed on themontiorThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalAmporhousSiliconWhat thephotodiodeis made of inindirectconversionSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imagePixelPitchthe physicaldistancebetweenpixelsEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorAnnotationAddingtext ormarkers tothe imageImageInversionchanges blackareas of theimage to whiteand whiteareas to blackMagnificationAllowsincreasedvisualizationof an area ofconcernQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceived

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


1
N N
2
N N
3
I I
4
I
5
N N
6
I I
7
B B
8
G G
9
I I
10
I I
11
O O
12
O O
13
B B
14
N N
15
I I
16
B B
17
I I
18
N N
19
G G
20
O O
21
N N
22
B B
23
G G
24
G G
25
B B
26
O O
27
G G
28
O O
29
B B
30
N N
31
G G
32
O O
33
O O
34
G G
35
B B
36
O O
37
B B
38
G G
39
I I
  1. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  2. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  3. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  4. I-Window Level
  5. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  6. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  7. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  8. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  9. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  10. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  11. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  12. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  13. B-what we can do to the image after it is displayed
    B-Post processing
  14. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  15. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  16. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  17. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  18. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  19. G-converts the analog electronic signal into a digital signal
    G-ADC
  20. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  21. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  22. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  23. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  24. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  25. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  26. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  27. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  28. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  29. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  30. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  31. G-the physical distance between pixels
    G-Pixel Pitch
  32. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  33. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  34. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  35. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  36. O-Adding text or markers to the image
    O-Annotation
  37. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  38. G-Allows increased visualization of an area of concern
    G-Magnification
  39. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization