EraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedPostprocessingwhat we cando to theimage after itis displayedWindowLevelComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaDACConverts digitalsingal back toanalog soimage can beviewed on themontiorPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guidephotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterAmporhousSiliconWhat thephotodiodeis made of inindirectconversionHighSpatialResolutionWhen youhave a highfill factor,you get thisFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorScintillatorused inindirect toconvertxrays tovisbile lightIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionADCconverts theanalogelectronicsignal into adigital signalImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleImageInversionchanges blackareas of theimage to whiteand whiteareas to blackScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedMagnificationAllowsincreasedvisualizationof an area ofconcernReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizePixelPitchthe physicaldistancebetweenpixelsPhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionAnnotationAddingtext ormarkers tothe imageEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedPostprocessingwhat we cando to theimage after itis displayedWindowLevelComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaDACConverts digitalsingal back toanalog soimage can beviewed on themontiorPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guidephotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterAmporhousSiliconWhat thephotodiodeis made of inindirectconversionHighSpatialResolutionWhen youhave a highfill factor,you get thisFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorScintillatorused inindirect toconvertxrays tovisbile lightIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionADCconverts theanalogelectronicsignal into adigital signalImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleImageInversionchanges blackareas of theimage to whiteand whiteareas to blackScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedMagnificationAllowsincreasedvisualizationof an area ofconcernReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizePixelPitchthe physicaldistancebetweenpixelsPhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionAnnotationAddingtext ormarkers tothe image

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


1
O O
2
I I
3
I I
4
B B
5
I
6
O O
7
B B
8
N N
9
N N
10
N N
11
I I
12
N N
13
O O
14
G G
15
B B
16
O O
17
B B
18
G G
19
I I
20
G G
21
G G
22
N N
23
B B
24
N N
25
O O
26
I I
27
I I
28
G G
29
N N
30
B B
31
B B
32
I I
33
G G
34
G G
35
B B
36
O O
37
G G
38
O O
39
O O
  1. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  2. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  3. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  4. B-what we can do to the image after it is displayed
    B-Post processing
  5. I-Window Level
  6. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  7. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  8. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  9. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  10. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  11. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  12. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  13. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  14. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  15. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  16. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  17. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  18. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  19. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  20. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  21. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  22. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  23. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  24. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  25. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  26. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  27. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  28. G-converts the analog electronic signal into a digital signal
    G-ADC
  29. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  30. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  31. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  32. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  33. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  34. G-Allows increased visualization of an area of concern
    G-Magnification
  35. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  36. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  37. G-the physical distance between pixels
    G-Pixel Pitch
  38. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  39. O-Adding text or markers to the image
    O-Annotation