BariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingPostprocessingwhat we cando to theimage after itis displayedComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedPixelPitchthe physicaldistancebetweenpixelsDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorHighSpatialResolutionWhen youhave a highfill factor,you get thisPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposurePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingDACConverts digitalsingal back toanalog soimage can beviewed on themontiorImageInversionchanges blackareas of theimage to whiteand whiteareas to blackWindowLevelConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notMagnificationAllowsincreasedvisualizationof an area ofconcernBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastAnnotationAddingtext ormarkers tothe imageADCconverts theanalogelectronicsignal into adigital signalIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the platephotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterScintillatorused inindirect toconvertxrays tovisbile lightRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageAmporhousSiliconWhat thephotodiodeis made of inindirectconversionBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingPostprocessingwhat we cando to theimage after itis displayedComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedPixelPitchthe physicaldistancebetweenpixelsDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorHighSpatialResolutionWhen youhave a highfill factor,you get thisPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposurePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingDACConverts digitalsingal back toanalog soimage can beviewed on themontiorImageInversionchanges blackareas of theimage to whiteand whiteareas to blackWindowLevelConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notMagnificationAllowsincreasedvisualizationof an area ofconcernBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastAnnotationAddingtext ormarkers tothe imageADCconverts theanalogelectronicsignal into adigital signalIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the platephotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterScintillatorused inindirect toconvertxrays tovisbile lightRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageAmporhousSiliconWhat thephotodiodeis made of inindirectconversion

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


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I I
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I I
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O O
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I I
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B B
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B B
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O O
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G G
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G G
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B B
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I I
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B B
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I I
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N N
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B B
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I
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N N
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G G
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G G
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O O
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N N
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O O
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N N
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I I
25
O O
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G G
27
O O
28
N N
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G G
30
O O
31
B B
32
O O
33
I I
34
B B
35
B B
36
N N
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G G
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N N
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G G
  1. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  2. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  3. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  4. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  5. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  6. B-what we can do to the image after it is displayed
    B-Post processing
  7. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  8. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  9. G-the physical distance between pixels
    G-Pixel Pitch
  10. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  11. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  12. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  13. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  14. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  15. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  16. I-Window Level
  17. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  18. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  19. G-Allows increased visualization of an area of concern
    G-Magnification
  20. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  21. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  22. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  23. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  24. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  25. O-Adding text or markers to the image
    O-Annotation
  26. G-converts the analog electronic signal into a digital signal
    G-ADC
  27. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  28. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  29. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  30. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  31. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  32. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  33. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  34. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  35. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  36. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  37. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  38. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  39. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon