ImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleDACConverts digitalsingal back toanalog soimage can beviewed on themontiorBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastHighSpatialResolutionWhen youhave a highfill factor,you get thisPostprocessingwhat we cando to theimage after itis displayedWindowLevelRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRADCconverts theanalogelectronicsignal into adigital signalScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionImageInversionchanges blackareas of theimage to whiteand whiteareas to blackEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsAmporhousSiliconWhat thephotodiodeis made of inindirectconversionConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessMagnificationAllowsincreasedvisualizationof an area ofconcernQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAnnotationAddingtext ormarkers tothe imagePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guidePixelPitchthe physicaldistancebetweenpixelsScintillatorused inindirect toconvertxrays tovisbile lightImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleDACConverts digitalsingal back toanalog soimage can beviewed on themontiorBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastHighSpatialResolutionWhen youhave a highfill factor,you get thisPostprocessingwhat we cando to theimage after itis displayedWindowLevelRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRADCconverts theanalogelectronicsignal into adigital signalScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionImageInversionchanges blackareas of theimage to whiteand whiteareas to blackEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsAmporhousSiliconWhat thephotodiodeis made of inindirectconversionConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessMagnificationAllowsincreasedvisualizationof an area ofconcernQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAnnotationAddingtext ormarkers tothe imagePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guidePixelPitchthe physicaldistancebetweenpixelsScintillatorused inindirect toconvertxrays tovisbile light

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


1
N N
2
N N
3
O O
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O O
5
I I
6
I I
7
B B
8
I
9
I I
10
G G
11
B B
12
B B
13
O O
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O O
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B B
16
I I
17
N N
18
G G
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N N
20
G G
21
I I
22
N N
23
B B
24
G G
25
G G
26
G G
27
O O
28
O O
29
O O
30
N N
31
B B
32
I I
33
I I
34
B B
35
B B
36
O O
37
G G
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G G
39
N N
  1. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  2. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  3. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  4. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  5. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  6. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  7. B-what we can do to the image after it is displayed
    B-Post processing
  8. I-Window Level
  9. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  10. G-converts the analog electronic signal into a digital signal
    G-ADC
  11. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  12. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  13. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  14. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  15. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  16. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  17. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  18. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  19. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  20. G-Allows increased visualization of an area of concern
    G-Magnification
  21. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  22. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  23. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  24. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  25. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  26. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  27. O-Adding text or markers to the image
    O-Annotation
  28. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  29. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  30. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  31. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  32. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  33. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  34. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  35. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  36. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  37. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  38. G-the physical distance between pixels
    G-Pixel Pitch
  39. N-used in indirect to convert xrays to visbile light
    N-Scintillator