ConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessAnnotationAddingtext ormarkers tothe imageImageInversionchanges blackareas of theimage to whiteand whiteareas to blackQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePixelPitchthe physicaldistancebetweenpixelsFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAmporhousSiliconWhat thephotodiodeis made of inindirectconversionWindowLevelProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorScintillatorused inindirect toconvertxrays tovisbile lightSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposurePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseMagnificationAllowsincreasedvisualizationof an area ofconcernBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureDACConverts digitalsingal back toanalog soimage can beviewed on themontiorIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellPostprocessingwhat we cando to theimage after itis displayedADCconverts theanalogelectronicsignal into adigital signalEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateHighSpatialResolutionWhen youhave a highfill factor,you get thisInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessAnnotationAddingtext ormarkers tothe imageImageInversionchanges blackareas of theimage to whiteand whiteareas to blackQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePixelPitchthe physicaldistancebetweenpixelsFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAmporhousSiliconWhat thephotodiodeis made of inindirectconversionWindowLevelProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorScintillatorused inindirect toconvertxrays tovisbile lightSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposurePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseMagnificationAllowsincreasedvisualizationof an area ofconcernBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureDACConverts digitalsingal back toanalog soimage can beviewed on themontiorIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellPostprocessingwhat we cando to theimage after itis displayedADCconverts theanalogelectronicsignal into adigital signalEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateHighSpatialResolutionWhen youhave a highfill factor,you get thisInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe image

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


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N N
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O O
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B B
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I I
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O O
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I I
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B B
8
G G
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G G
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G G
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I
12
N N
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B B
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I I
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B B
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N N
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O O
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I I
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I I
20
N N
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N N
22
G G
23
B B
24
O O
25
G G
26
G G
27
O O
28
N N
29
O O
30
I I
31
B B
32
O O
33
B B
34
G G
35
O O
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I I
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G G
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B B
39
N N
  1. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  2. O-Adding text or markers to the image
    O-Annotation
  3. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  4. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  5. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  6. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  7. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  8. G-the physical distance between pixels
    G-Pixel Pitch
  9. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  10. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  11. I-Window Level
  12. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  13. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  14. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  15. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  16. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  17. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  18. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  19. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  20. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  21. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  22. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  23. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  24. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  25. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  26. G-Allows increased visualization of an area of concern
    G-Magnification
  27. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  28. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  29. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  30. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  31. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  32. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  33. B-what we can do to the image after it is displayed
    B-Post processing
  34. G-converts the analog electronic signal into a digital signal
    G-ADC
  35. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  36. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  37. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  38. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  39. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors