WindowLevelAmporhousSiliconWhat thephotodiodeis made of inindirectconversionEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateHighSpatialResolutionWhen youhave a highfill factor,you get thisConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessScintillatorused inindirect toconvertxrays tovisbile lightImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visiblePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastMagnificationAllowsincreasedvisualizationof an area ofconcernTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedAnnotationAddingtext ormarkers tothe imageFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphasePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalADCconverts theanalogelectronicsignal into adigital signalDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeDACConverts digitalsingal back toanalog soimage can beviewed on themontiorReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingPixelPitchthe physicaldistancebetweenpixelsProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaPostprocessingwhat we cando to theimage after itis displayedImageInversionchanges blackareas of theimage to whiteand whiteareas to blackPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureWindowLevelAmporhousSiliconWhat thephotodiodeis made of inindirectconversionEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the plateHighSpatialResolutionWhen youhave a highfill factor,you get thisConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessScintillatorused inindirect toconvertxrays tovisbile lightImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visiblePhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastMagnificationAllowsincreasedvisualizationof an area ofconcernTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedAnnotationAddingtext ormarkers tothe imageFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphasePhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalADCconverts theanalogelectronicsignal into adigital signalDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargeFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionComputedRadiographyA cassettee-based systemwithphotostimulableimaging plateInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeDACConverts digitalsingal back toanalog soimage can beviewed on themontiorReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingPixelPitchthe physicaldistancebetweenpixelsProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaPostprocessingwhat we cando to theimage after itis displayedImageInversionchanges blackareas of theimage to whiteand whiteareas to blackPreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposure

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


1
I
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G G
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O O
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I I
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N N
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N N
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N N
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B B
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I I
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G G
11
N N
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I I
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O O
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I I
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I I
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O O
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G G
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G G
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O O
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G G
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O O
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G G
23
B B
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B B
25
N N
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B B
27
B B
28
O O
29
G G
30
O O
31
N N
32
B B
33
G G
34
N N
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B B
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B B
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I I
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I I
39
O O
  1. I-Window Level
  2. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  3. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  4. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  5. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  6. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  7. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  8. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  9. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  10. G-Allows increased visualization of an area of concern
    G-Magnification
  11. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  12. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  13. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  14. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  15. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  16. O-Adding text or markers to the image
    O-Annotation
  17. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  18. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  19. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  20. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable
  21. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  22. G-converts the analog electronic signal into a digital signal
    G-ADC
  23. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  24. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  25. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  26. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  27. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  28. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  29. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  30. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  31. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  32. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  33. G-the physical distance between pixels
    G-Pixel Pitch
  34. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  35. B-what we can do to the image after it is displayed
    B-Post processing
  36. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  37. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  38. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  39. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue