IndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAmporhousSiliconWhat thephotodiodeis made of inindirectconversionImageInversionchanges blackareas of theimage to whiteand whiteareas to blackLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofMagnificationAllowsincreasedvisualizationof an area ofconcernThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePixelPitchthe physicaldistancebetweenpixelsPhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRWindowLevelDACConverts digitalsingal back toanalog soimage can beviewed on themontiorHighSpatialResolutionWhen youhave a highfill factor,you get thisphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the platePostprocessingwhat we cando to theimage after itis displayedADCconverts theanalogelectronicsignal into adigital signalScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionScintillatorused inindirect toconvertxrays tovisbile lightAnnotationAddingtext ormarkers tothe imageReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processedIndirectconversionA two stepconversion thattakes xrays tolight to anelectric signalFillFactorA comparison ofthe area thatsenses theelectricalsingal/lightcompared to areathat does notAmporhousSiliconWhat thephotodiodeis made of inindirectconversionImageInversionchanges blackareas of theimage to whiteand whiteareas to blackLookupTablepermits theprocessed pixelvalues to bemanipulated toadjust changes inbrightness orcontrastAmorphusSeleniumWhatphotoconductoris made out ofused in directconversionInterpolationA method usedto fil in the deadpixels with infousing thesurrounds pixelsas a guideSpatialResolutionSharpnessor recordeddetail--isrelated topixel sizeBariumFlurohalide"doped" witheuropiumactivatorsWhat thephosphorlayer of theCR plate ismade ofMagnificationAllowsincreasedvisualizationof an area ofconcernThin-Film-Transistoracts as a grideof tiny switches,activates eachpizel to sendsignal to thecompouterPhosphorLayer ofCR PlateActive componentthat holdsphotostimulablephosphors andtraps e- duringexposureComputedRadiographyA cassettee-based systemwithphotostimulableimaging platePixelPitchthe physicaldistancebetweenpixelsPhotoconductorsAbsorb x-raysand cause anelectricalcharge used indirectconversionRedThe color of thelaser beam thatfrees trappedelectrons duringstimulationphaseQuantizationA step thatoccures after IRexposure thatassigns a value toeach pixel relativetot he energy itreceivedTypes ofPre-ProcessingErrorsScatter fog,collimation errors,prostheses withinthe image,barium bolus inthe imageRasterPatternThis is the patternin which thephosphors arescanned with alaser bean duringstimulation phaseof CRWindowLevelDACConverts digitalsingal back toanalog soimage can beviewed on themontiorHighSpatialResolutionWhen youhave a highfill factor,you get thisphotodiodemade ofamorphous silicon,takes light photonsin indirect captureand converets toelectic chargePreprocessingWhat occursbefore we seethe iamge. Alsocalled imageacquisitionprocessingDirectconversionA one stepprocess wherex-rays areabsorebed by aphotoconductorProtective(Supportive)layer of CRPlateInsulatesimagingplate fromhandlingtraumaConductorLayerGroundselectrostaticproblems in theCR plate andincreases imagesharpnessBlueThe color of lightemitted duringphotostimulableluminescence this isthe light is directlyporportional to theamount of radiation theplate absorbed duringexposureEraseThe last phase ofthe CR process thatallows the CR to beresued. A highintesity light sourcereleases any e-trapped in the platePostprocessingwhat we cando to theimage after itis displayedADCconverts theanalogelectronicsignal into adigital signalScintillatorsPhosphors thatproduce LIGHTwhen exposedto x-ray-used inindirectconversionScintillatorused inindirect toconvertxrays tovisbile lightAnnotationAddingtext ormarkers tothe imageReflectiveLayer ofCR platePrevents lightfrom erasingdata on imagingplate or leakingthrough backingFlatPanelArtifactDead dexel,incorrect gaincolibraion andimage lag aretypes of theseartifactsCesiumIodideScintillator ismade of, a highatomic number--absorbs xrayswellImagelagIf a 2nd image istaken before thedetector release allthe singla fromprevious image, afaint image ofprevious exposuremay be visibleMetastableThis means thatelectronseventually loseenergy over timeif the CR plate isnot processed

RAD 267 Week 3 - Call List

(Print) Use this randomly generated list as your call list when playing the game. Place some kind of mark (like an X, a checkmark, a dot, tally mark, etc) on each cell as you announce it, to keep track. You can also cut out each item, place them in a bag and pull words from the bag.


1
O O
2
G G
3
G G
4
B B
5
I I
6
I I
7
G G
8
O O
9
I I
10
G G
11
B B
12
B B
13
O O
14
G G
15
O O
16
G G
17
I I
18
N N
19
I I
20
I
21
N N
22
I I
23
B B
24
I I
25
B B
26
N N
27
N N
28
O O
29
O O
30
B B
31
G G
32
B B
33
N N
34
O O
35
B B
36
N N
37
O O
38
N N
39
G G
  1. O-A two step conversion that takes xrays to light to an electric signal
    O-Indirect conversion
  2. G-A comparison of the area that senses the electrical singal/light compared to area that does not
    G-Fill Factor
  3. G-What the photodiode is made of in indirect conversion
    G-Amporhous Silicon
  4. B-changes black areas of the image to white and white areas to black
    B-Image Inversion
  5. I-permits the processed pixel values to be manipulated to adjust changes in brightness or contrast
    I-Look up Table
  6. I-What photoconductor is made out of used in direct conversion
    I-Amorphus Selenium
  7. G-A method used to fil in the dead pixels with info using the surrounds pixels as a guide
    G-Interpolation
  8. O-Sharpness or recorded detail--is related to pixel size
    O-Spatial Resolution
  9. I-What the phosphor layer of the CR plate is made of
    I-Barium Flurohalide "doped" with europium activators
  10. G-Allows increased visualization of an area of concern
    G-Magnification
  11. B-acts as a gride of tiny switches, activates each pizel to send signal to the compouter
    B-Thin-Film- Transistor
  12. B-Active component that holds photostimulable phosphors and traps e- during exposure
    B-Phosphor Layer of CR Plate
  13. O-A cassettee-based system with photostimulable imaging plate
    O-Computed Radiography
  14. G-the physical distance between pixels
    G-Pixel Pitch
  15. O-Absorb x-rays and cause an electrical charge used in direct conversion
    O-Photoconductors
  16. G-The color of the laser beam that frees trapped electrons during stimulation phase
    G-Red
  17. I-A step that occures after IR exposure that assigns a value to each pixel relative tot he energy it received
    I-Quantization
  18. N-Scatter fog, collimation errors, prostheses within the image, barium bolus in the image
    N-Types of Pre-Processing Errors
  19. I-This is the pattern in which the phosphors are scanned with a laser bean during stimulation phase of CR
    I-Raster Pattern
  20. I-Window Level
  21. N-Converts digital singal back to analog so image can be viewed on the montior
    N-DAC
  22. I-When you have a high fill factor, you get this
    I-High Spatial Resolution
  23. B-made of amorphous silicon, takes light photons in indirect capture and converets to electic charge
    B-photodiode
  24. I-What occurs before we see the iamge. Also called image acquisition processing
    I-Pre processing
  25. B-A one step process where x-rays are absorebed by a photoconductor
    B-Direct conversion
  26. N-Insulates imaging plate from handling trauma
    N-Protective (Supportive) layer of CR Plate
  27. N-Grounds electrostatic problems in the CR plate and increases image sharpness
    N-Conductor Layer
  28. O-The color of light emitted during photostimulable luminescence this is the light is directly porportional to the amount of radiation the plate absorbed during exposure
    O-Blue
  29. O-The last phase of the CR process that allows the CR to be resued. A high intesity light source releases any e-trapped in the plate
    O-Erase
  30. B-what we can do to the image after it is displayed
    B-Post processing
  31. G-converts the analog electronic signal into a digital signal
    G-ADC
  32. B-Phosphors that produce LIGHT when exposed to x-ray-used in indirect conversion
    B-Scintillators
  33. N-used in indirect to convert xrays to visbile light
    N-Scintillator
  34. O-Adding text or markers to the image
    O-Annotation
  35. B-Prevents light from erasing data on imaging plate or leaking through backing
    B-Reflective Layer of CR plate
  36. N-Dead dexel, incorrect gain colibraion and image lag are types of these artifacts
    N-Flat Panel Artifact
  37. O-Scintillator is made of, a high atomic number--absorbs xrays well
    O-Cesium Iodide
  38. N-If a 2nd image is taken before the detector release all the singla from previous image, a faint image of previous exposure may be visible
    N-Image lag
  39. G-This means that electrons eventually lose energy over time if the CR plate is not processed
    G-Metastable